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G11X15 - DDR3L 8GB [2x4GB] 1866Mhz - KINGSTON HYPERX HyperX FURY Memory Low Voltage [ HX318LC11FBK28 ]

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HX318LC11FBK2/8 8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3L-1866 CL11 240-Pin DIMM Kit

HyperX HX318LC11FBK2/8 is a kit of two 512M x 64-bit (4GB) DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory modules, based on eight 512M x 8-bit DDR3 FBGA components. Total kit capacity is 8GB. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. This module has been tested to run at DDR3L-1866 at a low latency timing of 11-11-11 at 1.35V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications areas follows:

Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS.

• JEDEC standard 1.35V and 1.5V Power Supply
• VDDQ = 1.35V and 1.5V
• 933MHz fCK for 1866Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C
• Asynchronous Reset
• Height 1.291” (32.80mm) w/heatsink, single sided component

DDR3L-1866 CL11-11-11 @1.35V/1.5V
DDR3L-1600 CL10-10-10 @1.35V/1.5V
DDR3L-1333 CL8-8-8 @1.35V/1.5V
• XMP Profile #1: DDR3L-1866 CL11-11-11 @1.35V
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